Wafer Carrier

Wafer Carrier

This is made via a precision injection melding method adopting designs that are suitable for semiconductor manufacturing lines, as well as high-performance engineering materials.

Features

• Hear registrant(50°C ~ 180°C)
• Antistatic ability(1010 ~ 1012)
• Use high-performance engineering plastics(Minimal production of emitted particle)
• Bar-code
• High electrets charging ability
• Various Color(Orange, Gray, Green, Yellow, Blue)
• Robot Handling abilities
• Custom-tailored designs & productions

Standard Specification

4"(100mm), 5"(125mm), 6"(150mm), 8"(200mm), 12"(300mm) Wafer Size Standard

Essential Application

Used for manual or automatic semiconductor producing processes, including wafer cleaning, loading, keeping and transferring actions.

New Product(12" FOUP)

1. Use of the same slot for body(Box) & Wafer
   - Minimized impact on internal particles
2. Wafer insides can be clearly seen
   -Use of the transparent plastic window
3. Opening/closing of door by either manual or Jig
4. Application of tension on the lock cam
   - Convenient lock cam structure
5. Double sealing(packing) structure for air tightness
6. Strength/durability/wear resistant(minimal production of particles)
7. Wafer fixation & stabilization
8. Accumulation
9. Convenient cleaning
10. Robot handling abilities(auto wafer transfer)
11. Use of high-performance engineering plastics
    -(Antistatic ability)